Semiconductor Wafer Grinder from China
Automatic wafer grinder that processes sliced wafers to precise diameter and flatness specifications for semiconductor fabrication, classified as auxiliary machinery under HTS 8448.20.50.90 for heading 8444 equipment. Critical for achieving wafer tolerances of ±1 micron.
Duty Rate — China → United States
20.8%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Submit engineering drawings showing semiconductor-specific features like vacuum chucks
• Document flatness specifications (typically <1 micron across 300mm wafers) for classification support
• Confirm exclusion from Chapter 90 by verifying primary grinding vs testing function