Semiconductor Wafer Grinder from Canada
Automatic wafer grinder that processes sliced wafers to precise diameter and flatness specifications for semiconductor fabrication, classified as auxiliary machinery under HTS 8448.20.50.90 for heading 8444 equipment. Critical for achieving wafer tolerances of ±1 micron.
Duty Rate — Canada → United States
13.3%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Submit engineering drawings showing semiconductor-specific features like vacuum chucks
• Document flatness specifications (typically <1 micron across 300mm wafers) for classification support
• Confirm exclusion from Chapter 90 by verifying primary grinding vs testing function