Crystal Boule Grinder from Japan
Precision grinder for shaping semiconductor crystal boules to exact wafer diameters (150mm-450mm), including flat grinding for conductivity indication. HTS 8448.20.50.90 classification as auxiliary for heading 8444 crystal pullers.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include boule diameter range and flat positioning specifications in import documentation
• Provide statistical note reference confirming boule preparation function
• Ensure classification distinguishes from general metallurgical grinders