Crystal Boule Grinder from Japan
Precision grinder for shaping semiconductor crystal boules to exact wafer diameters (150mm-450mm), including flat grinding for conductivity indication. HTS 8448.20.50.90 classification as auxiliary for heading 8444 crystal pullers.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include boule diameter range and flat positioning specifications in import documentation
• Provide statistical note reference confirming boule preparation function
• Ensure classification distinguishes from general metallurgical grinders