Wafer Surface Flatness Dot Matrix Printer from Japan
Dot matrix printer for wafer grinders/lappers printing surface flatness measurements critical for fabrication tolerance. Under HTS 8443.99.50 for printing parts in semiconductor wafer preparation (statistical note (a)(ii)(C)). Impact printing for multi-copy process sheets.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include flatness measurement correlation data; specify impact printing mechanism; cleanroom assembly verification required