Wafer Surface Flatness Dot Matrix Printer from China
Dot matrix printer for wafer grinders/lappers printing surface flatness measurements critical for fabrication tolerance. Under HTS 8443.99.50 for printing parts in semiconductor wafer preparation (statistical note (a)(ii)(C)). Impact printing for multi-copy process sheets.
Duty Rate — China → United States
20%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Include flatness measurement correlation data; specify impact printing mechanism; cleanroom assembly verification required