Semiconductor Wafer ID Inkjet Printer from Japan
Industrial inkjet printer for direct wafer identification printing before slicing, including boule source and slice sequence codes. HTS 8443.99.50 for printing accessories in wafer manufacturing apparatus. Non-contact printing prevents contamination.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify non-porous substrate compatibility; provide wafer handling system integration drawings; test inks for semiconductor material compatibility