Semiconductor Wafer ID Inkjet Printer from Japan
Industrial inkjet printer for direct wafer identification printing before slicing, including boule source and slice sequence codes. HTS 8443.99.50 for printing accessories in wafer manufacturing apparatus. Non-contact printing prevents contamination.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify non-porous substrate compatibility; provide wafer handling system integration drawings; test inks for semiconductor material compatibility