Semiconductor Wafer ID Inkjet Printer from Japan
Industrial inkjet printer for direct wafer identification printing before slicing, including boule source and slice sequence codes. HTS 8443.99.50 for printing accessories in wafer manufacturing apparatus. Non-contact printing prevents contamination.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify non-porous substrate compatibility; provide wafer handling system integration drawings; test inks for semiconductor material compatibility