Semiconductor Wafer Slicing Diamond Saw from Japan
Precision diamond wire saw slices monocrystalline boules into thin semiconductor wafers for use in printing processes with heading 8442 machinery. Ensures minimal kerf loss for high-yield printing substrates. Under 8443.91.10.00 as ancillary to printing.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify wire tension and speed specs match statistical note wafer prep requirements
• Pair with boule supplier affidavits for chain-of-custody