Semiconductor Wafer Slicing Diamond Saw from Japan
Precision diamond wire saw slices monocrystalline boules into thin semiconductor wafers for use in printing processes with heading 8442 machinery. Ensures minimal kerf loss for high-yield printing substrates. Under 8443.91.10.00 as ancillary to printing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Certify wire tension and speed specs match statistical note wafer prep requirements
• Pair with boule supplier affidavits for chain-of-custody