Semiconductor Wafer Slicing Diamond Saw from Canada
Precision diamond wire saw slices monocrystalline boules into thin semiconductor wafers for use in printing processes with heading 8442 machinery. Ensures minimal kerf loss for high-yield printing substrates. Under 8443.91.10.00 as ancillary to printing.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Certify wire tension and speed specs match statistical note wafer prep requirements
• Pair with boule supplier affidavits for chain-of-custody