Double-Sided Wafer Lapper for Flatness Control from Mexico
Laps both sides of semiconductor wafers simultaneously to achieve ultra-flat surfaces required for printing alignment in heading 8442 systems. Ancillary preparation machine per statistical wafer notes. Classified 8443.91.10.00.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Provide flatness tolerance data (e.g
• <1 micron) proving printing readiness
• Slurry composition docs prevent hazmat flags