</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8443.91.10.00/Chemical Mechanical Wafer Polisher/Japan

Chemical Mechanical Wafer Polisher from Japan

CMP polisher planarizes semiconductor wafers using slurry for mirror-finish surfaces essential to printing processes in heading 8442 photolithography. Key ancillary machine in wafer prep sequence. Under 8443.91.10.00.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Calculate with your customs valueVerify classification with AI

Import Tips

• Include slurry flow rate and pad pressure specs for classification support

• Chemical safety data sheets mandatory

Chemical Mechanical Wafer Polisher from Japan — Import Duty Rate | HTS 8443.91.10.00