Used Wafer Slicing Diamond Saw from Japan
Used diamond wire saw for slicing thin wafers from monocrystalline semiconductor boules, as in statistical note (a)(ii)(B). Falls under 8439.10.0090 for used machinery in pulp-making from fibrous cellulosic semiconductor materials.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include wire tension and blade wear logs to prove usage and rebuild status
• Declare diamond content accurately to prevent undervaluation penalties
• Ensure coolant system residue testing for import health/safety clearance