8439.10.00.90/Used Wafer Slicing Diamond Saw/Japan

Used Wafer Slicing Diamond Saw from Japan

Used diamond wire saw for slicing thin wafers from monocrystalline semiconductor boules, as in statistical note (a)(ii)(B). Falls under 8439.10.0090 for used machinery in pulp-making from fibrous cellulosic semiconductor materials.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Calculate with your customs value Verify classification with AI

Import Tips

• Include wire tension and blade wear logs to prove usage and rebuild status

• Declare diamond content accurately to prevent undervaluation penalties

• Ensure coolant system residue testing for import health/safety clearance