Used Wafer Slicing Diamond Saw from China
Used diamond wire saw for slicing thin wafers from monocrystalline semiconductor boules, as in statistical note (a)(ii)(B). Falls under 8439.10.0090 for used machinery in pulp-making from fibrous cellulosic semiconductor materials.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include wire tension and blade wear logs to prove usage and rebuild status
• Declare diamond content accurately to prevent undervaluation penalties
• Ensure coolant system residue testing for import health/safety clearance