Used Wafer Slicing Diamond Saw from Canada
Used diamond wire saw for slicing thin wafers from monocrystalline semiconductor boules, as in statistical note (a)(ii)(B). Falls under 8439.10.0090 for used machinery in pulp-making from fibrous cellulosic semiconductor materials.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Include wire tension and blade wear logs to prove usage and rebuild status
• Declare diamond content accurately to prevent undervaluation penalties
• Ensure coolant system residue testing for import health/safety clearance