8439.10.00.90/Used Semiconductor Wafer Polisher/Japan

Used Semiconductor Wafer Polisher from Japan

Used chemical-mechanical polisher (CMP) for surface finishing of silicon wafers to atomic flatness. Matches statistical note (a)(ii)(C) wafer polishers, under used pulp-finishing machinery 8439.10.0090.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide slurry residue analysis for hazmat compliance

• Avoid classifying pad conditioners separately to maintain set integrity

• Register with semiconductor equipment standards bodies pre-import