Used Semiconductor Wafer Polisher from Japan
Used chemical-mechanical polisher (CMP) for surface finishing of silicon wafers to atomic flatness. Matches statistical note (a)(ii)(C) wafer polishers, under used pulp-finishing machinery 8439.10.0090.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide slurry residue analysis for hazmat compliance
• Avoid classifying pad conditioners separately to maintain set integrity
• Register with semiconductor equipment standards bodies pre-import