Used Semiconductor Wafer Polisher from Germany

Used chemical-mechanical polisher (CMP) for surface finishing of silicon wafers to atomic flatness. Matches statistical note (a)(ii)(C) wafer polishers, under used pulp-finishing machinery 8439.10.0090.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Import Tips

Provide slurry residue analysis for hazmat compliance

Avoid classifying pad conditioners separately to maintain set integrity

Register with semiconductor equipment standards bodies pre-import