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8439.10.00.90/Rebuilt Wafer Lapping Machine/Mexico

Rebuilt Wafer Lapping Machine from Mexico

Rebuilt lapping equipment for flatness correction on semiconductor wafers prior to polishing, per statistical note (a)(ii)(C). Classified as rebuilt pulp machinery under 8439.10.0090 for cellulosic material finishing.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Document lapping plate resurfacing to support 'rebuilt' claim

• Calibrate and certify flatness gauges before shipment

Rebuilt Wafer Lapping Machine from Mexico — Import Duty Rate | HTS 8439.10.00.90