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8439.10.00.90/Rebuilt Wafer Lapping Machine/Japan

Rebuilt Wafer Lapping Machine from Japan

Rebuilt lapping equipment for flatness correction on semiconductor wafers prior to polishing, per statistical note (a)(ii)(C). Classified as rebuilt pulp machinery under 8439.10.0090 for cellulosic material finishing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document lapping plate resurfacing to support 'rebuilt' claim

• Calibrate and certify flatness gauges before shipment

Rebuilt Wafer Lapping Machine from Japan — Import Duty Rate | HTS 8439.10.00.90