Rebuilt Wafer Lapping Machine from Germany
Rebuilt lapping equipment for flatness correction on semiconductor wafers prior to polishing, per statistical note (a)(ii)(C). Classified as rebuilt pulp machinery under 8439.10.0090 for cellulosic material finishing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document lapping plate resurfacing to support 'rebuilt' claim
• Calibrate and certify flatness gauges before shipment