Rebuilt Wafer Lapping Machine from Canada

Rebuilt lapping equipment for flatness correction on semiconductor wafers prior to polishing, per statistical note (a)(ii)(C). Classified as rebuilt pulp machinery under 8439.10.0090 for cellulosic material finishing.

Duty Rate — Canada → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Import Tips

Document lapping plate resurfacing to support 'rebuilt' claim

Calibrate and certify flatness gauges before shipment

Rebuilt Wafer Lapping Machine from Canada — Import Duty Rate | HTS 8439.10.00.90