New Wafer Lapping Machine from Germany
Automated lapping equipment that uses abrasive slurries to flatten and thin semiconductor wafers to precise tolerances before polishing. Under HTS 8439.10.0010 as new wafer preparation machinery for cellulosic pulp processing in semiconductor statistical notes. Critical for achieving wafer flatness required in fabrication.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include slurry compatibility certification for silicon/GaAs wafers
• Document as 'new' via factory test reports
• Common error: classifying under general lapping tools in 8460.42