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8439.10.00.10/New Wafer Edge Grinder/Mexico

New Wafer Edge Grinder from Mexico

Edge profiling grinder to chamfer and round semiconductor wafer edges preventing chipping during handling and processing. HTS 8439.10.0010 new wafer prep equipment.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Edge profile tolerance specs required

• New status via calibration certs