New Wafer Edge Grinder from Mexico
Edge profiling grinder to chamfer and round semiconductor wafer edges preventing chipping during handling and processing. HTS 8439.10.0010 new wafer prep equipment.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Edge profile tolerance specs required
• New status via calibration certs