</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8439.10.00.10/New Wafer Edge Grinder/Japan

New Wafer Edge Grinder from Japan

Edge profiling grinder to chamfer and round semiconductor wafer edges preventing chipping during handling and processing. HTS 8439.10.0010 new wafer prep equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Calculate with your customs valueVerify classification with AI

Import Tips

• Edge profile tolerance specs required

• New status via calibration certs