New Wafer Edge Grinder from Germany
Edge profiling grinder to chamfer and round semiconductor wafer edges preventing chipping during handling and processing. HTS 8439.10.0010 new wafer prep equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Edge profile tolerance specs required
• New status via calibration certs