New Wafer Edge Grinder from Canada
Edge profiling grinder to chamfer and round semiconductor wafer edges preventing chipping during handling and processing. HTS 8439.10.0010 new wafer prep equipment.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Edge profile tolerance specs required
• New status via calibration certs