New Semiconductor Wafer Slicing Saw from Japan
High-precision inner-diameter saw for slicing ultra-thin wafers from monocrystalline semiconductor boules with minimal kerf loss and damage. Classified in new category HTS 8439.10.0010 for wafer preparation in pulp-making machinery per statistical notes. Uses diamond blades for silicon and compound semiconductors.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide blade specs and slicing tolerance data to prove semiconductor application
• Ensure customs declaration specifies 'new' with serial numbers unused
• Pitfall: mislabeling as woodworking saws under 8465