New Crystal Boule Grinder from China
Precision grinder for semiconductor crystal boules, used to achieve exact diameter and grind flats indicating conductivity type and resistivity prior to wafer slicing. HTS 8439.10.0010 covers this new wafer preparation equipment for fibrous cellulosic material processing in semiconductor context. Ensures wafers meet tight tolerances for device fabrication.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Submit engineering drawings highlighting semiconductor-specific features like flat grinding for resistivity marking
• Confirm 'new' with no prior use documentation
• Avoid pitfall of classifying as general grinding machines under 8460