New CMP Wafer Polisher from Japan
Chemical Mechanical Planarization (CMP) polisher for final surface finishing of semiconductor wafers, removing material uniformly to nanometer flatness. HTS 8439.10.0010 for new finishing machinery in semiconductor wafer prep per chapter notes. Uses polishing pads and slurries for device-ready surfaces.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Demonstrate CMP-specific features like pad conditioning in technical files
• Affix 'new equipment' labels pre-shipment
• Pitfall: confusion with optical polishers in 8464