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Wafer Slicing Saw Mobile Dolly Wheel from Mexico

Reinforced road wheel assembly for mobile wafer slicing saws that cut monocrystalline semiconductor boules into wafers. HTS 8431.49.90.84 applies to road wheels of heading 8430 semiconductor processing machinery.

Duty Rate — Mexico → United States

25%

Rate breakdown

9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter

Import Tips

Classify as sets if importing complete wheel assemblies with axles; single wheels may qualify differently

Maintain records showing principal use with wafer slicing saws for Customs valuation purposes

Test for cleanroom compatibility certifications to support semiconductor-specific classification