Wafer Slicing Saw Mobile Dolly Wheel from Japan
Reinforced road wheel assembly for mobile wafer slicing saws that cut monocrystalline semiconductor boules into wafers. HTS 8431.49.90.84 applies to road wheels of heading 8430 semiconductor processing machinery.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Section 232: derivative steel (c)(xi), product of AR/EC/SV/GT/JP/KR/LI/CH/TW/GB/EU — 15%
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Classify as sets if importing complete wheel assemblies with axles; single wheels may qualify differently
• Maintain records showing principal use with wafer slicing saws for Customs valuation purposes
• Test for cleanroom compatibility certifications to support semiconductor-specific classification