Wafer Slicing Saw Mobile Dolly Wheel from Germany
Reinforced road wheel assembly for mobile wafer slicing saws that cut monocrystalline semiconductor boules into wafers. HTS 8431.49.90.84 applies to road wheels of heading 8430 semiconductor processing machinery.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Classify as sets if importing complete wheel assemblies with axles; single wheels may qualify differently
• Maintain records showing principal use with wafer slicing saws for Customs valuation purposes
• Test for cleanroom compatibility certifications to support semiconductor-specific classification