Wafer Slicing Saw Mobile Dolly Wheel from China
Reinforced road wheel assembly for mobile wafer slicing saws that cut monocrystalline semiconductor boules into wafers. HTS 8431.49.90.84 applies to road wheels of heading 8430 semiconductor processing machinery.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Classify as sets if importing complete wheel assemblies with axles; single wheels may qualify differently
• Maintain records showing principal use with wafer slicing saws for Customs valuation purposes
• Test for cleanroom compatibility certifications to support semiconductor-specific classification