Wafer Lapping Machine Facility Wheel from Mexico
Heavy load-bearing road wheel for intrafacility transport of wafer lapping machines that achieve critical surface flatness for semiconductor fabrication. HTS 8431.49.90.84 specifically covers these road wheels for heading 8430 machinery.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Document cleanroom classification (ISO standards) to substantiate semiconductor end-use
• Calculate duties based on complete wheel assembly value, not component materials
• Consider bonded warehouse entry for wheels awaiting specific machinery import