Wafer Lapping Machine Facility Wheel from Japan
Heavy load-bearing road wheel for intrafacility transport of wafer lapping machines that achieve critical surface flatness for semiconductor fabrication. HTS 8431.49.90.84 specifically covers these road wheels for heading 8430 machinery.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document cleanroom classification (ISO standards) to substantiate semiconductor end-use
• Calculate duties based on complete wheel assembly value, not component materials
• Consider bonded warehouse entry for wheels awaiting specific machinery import