Wafer Lapping Machine Facility Wheel from Japan
Heavy load-bearing road wheel for intrafacility transport of wafer lapping machines that achieve critical surface flatness for semiconductor fabrication. HTS 8431.49.90.84 specifically covers these road wheels for heading 8430 machinery.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.2215%Derivative steel articles the product of Argentina, Ecuador, El Salvador, Guatemala, Japan, the Republic of Korea, Liechtenstein, Switzerland, Taiwan, the United Kingdom, or a member nation of the European Union, as provided for in subdivision (c)(xi) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Document cleanroom classification (ISO standards) to substantiate semiconductor end-use
• Calculate duties based on complete wheel assembly value, not component materials
• Consider bonded warehouse entry for wheels awaiting specific machinery import