Robotic Wafer Handling Arm from Japan
An articulated robotic arm with end-effectors for lifting, transferring, and positioning semiconductor wafers between processing stations in fabs. Classified under HTS 8428.90.03 as other machinery for precise handling of fragile semiconductor materials.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.1225%Except as provided for in headings 9903.82.17 and 9903.85.68, derivative aluminum and steel articles the product of any country identified in general note 3(b), as provided for in subdivisions (c)(ix)–(x) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Provide robot kinematics data and payload specs for wafers to support lifting machinery classification
• Ensure ESD-safe materials are documented to meet semiconductor handling standards