Robotic Wafer Handling Arm from Japan
An articulated robotic arm with end-effectors for lifting, transferring, and positioning semiconductor wafers between processing stations in fabs. Classified under HTS 8428.90.03 as other machinery for precise handling of fragile semiconductor materials.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide robot kinematics data and payload specs for wafers to support lifting machinery classification
• Ensure ESD-safe materials are documented to meet semiconductor handling standards