Pneumatic Wafer Edge Conveyor for Lapping Lines from Germany
Pneumatic conveyor gripping wafers by edges for transfer between lapping, grinding, and polishing stations in wafer preparation. Specifically covered under HTS 8428.20.0010 for pneumatic conveyors in semiconductor processing equipment. Ensures edge-only contact to protect wafer surfaces.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document pneumatic pressure specs and edge grip mechanism patents/design files
• Link to wafer grinder/lapper integration in technical specifications submitted
• Avoid Chapter 84 parts classification by proving standalone conveyor functionality