Pneumatic Wafer Edge Conveyor for Lapping Lines from China
Pneumatic conveyor gripping wafers by edges for transfer between lapping, grinding, and polishing stations in wafer preparation. Specifically covered under HTS 8428.20.0010 for pneumatic conveyors in semiconductor processing equipment. Ensures edge-only contact to protect wafer surfaces.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Document pneumatic pressure specs and edge grip mechanism patents/design files
• Link to wafer grinder/lapper integration in technical specifications submitted
• Avoid Chapter 84 parts classification by proving standalone conveyor functionality