Wafer Slicing Saw Coolant Jet Nozzle from Japan
Precision nozzle for projecting coolant jets onto diamond saw blades during wafer slicing from semiconductor boules. It qualifies for HTS 8424.90.90.40 as a part of jet projecting machines in wafer preparation equipment. High-pressure jets maintain blade cooling and flush debris for defect-free wafer slices.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Label with exact material compatibility (e.g
• silicon carbide resistant) and pressure ratings for customs validation
• Bundle with saw documentation to prove integral part status versus replacement wear item
• Avoid pitfall of classifying as 8202 saw parts; emphasize liquid jet projection function