Wafer Slicing Saw Coolant Jet Nozzle from Japan
Precision nozzle for projecting coolant jets onto diamond saw blades during wafer slicing from semiconductor boules. It qualifies for HTS 8424.90.90.40 as a part of jet projecting machines in wafer preparation equipment. High-pressure jets maintain blade cooling and flush debris for defect-free wafer slices.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Label with exact material compatibility (e.g
• silicon carbide resistant) and pressure ratings for customs validation
• Bundle with saw documentation to prove integral part status versus replacement wear item
• Avoid pitfall of classifying as 8202 saw parts; emphasize liquid jet projection function