Wafer Slicing Saw Coolant Jet Nozzle from Germany
Precision nozzle for projecting coolant jets onto diamond saw blades during wafer slicing from semiconductor boules. It qualifies for HTS 8424.90.90.40 as a part of jet projecting machines in wafer preparation equipment. High-pressure jets maintain blade cooling and flush debris for defect-free wafer slices.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Label with exact material compatibility (e.g
• silicon carbide resistant) and pressure ratings for customs validation
• Bundle with saw documentation to prove integral part status versus replacement wear item
• Avoid pitfall of classifying as 8202 saw parts; emphasize liquid jet projection function