Wafer Slicing Saw Coolant Jet Nozzle from China
Precision nozzle for projecting coolant jets onto diamond saw blades during wafer slicing from semiconductor boules. It qualifies for HTS 8424.90.90.40 as a part of jet projecting machines in wafer preparation equipment. High-pressure jets maintain blade cooling and flush debris for defect-free wafer slices.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Label with exact material compatibility (e.g
• silicon carbide resistant) and pressure ratings for customs validation
• Bundle with saw documentation to prove integral part status versus replacement wear item
• Avoid pitfall of classifying as 8202 saw parts; emphasize liquid jet projection function