Wafer Polishing Head Fluid Jet Nozzle from Germany
Nozzle array in polishing heads that projects polishing slurry jets for mirror-finish wafer surfaces in semiconductor fabrication prep. HTS 8424.90.90.40 applies to these jet projecting machine parts essential for sub-micron surface roughness. Ensures defect-free starting wafers for device processing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify diamond slurry compatibility and pressure differentials in technical data sheets
• Maintain import records showing integration with CMP equipment for parts classification
• Avoid 9017 lab apparatus misclassification by proving industrial semiconductor use