Wafer Polishing Head Fluid Jet Nozzle from China
Nozzle array in polishing heads that projects polishing slurry jets for mirror-finish wafer surfaces in semiconductor fabrication prep. HTS 8424.90.90.40 applies to these jet projecting machine parts essential for sub-micron surface roughness. Ensures defect-free starting wafers for device processing.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Specify diamond slurry compatibility and pressure differentials in technical data sheets
• Maintain import records showing integration with CMP equipment for parts classification
• Avoid 9017 lab apparatus misclassification by proving industrial semiconductor use