Wafer Polishing Head Fluid Jet Nozzle from Canada
Nozzle array in polishing heads that projects polishing slurry jets for mirror-finish wafer surfaces in semiconductor fabrication prep. HTS 8424.90.90.40 applies to these jet projecting machine parts essential for sub-micron surface roughness. Ensures defect-free starting wafers for device processing.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify diamond slurry compatibility and pressure differentials in technical data sheets
• Maintain import records showing integration with CMP equipment for parts classification
• Avoid 9017 lab apparatus misclassification by proving industrial semiconductor use