</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8424.89.10.00/Flux Spraying Machine for SMT Printed Circuit Assembly/Japan

Flux Spraying Machine for SMT Printed Circuit Assembly from Japan

Automated mechanical sprayer that projects selective flux onto PCB pads prior to surface-mount soldering, ensuring reliable joints in high-volume assembly. Optimized for printed circuit assemblies with programmable spray patterns. HTS 8424.89.10.00 classification applies due to exclusive use in PCB soldering processes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Calculate with your customs valueVerify classification with AI

Import Tips

• Document flux viscosity ranges and nozzle orifice sizes to prove precision for micro-SMT pads

• Require manufacturer's declaration confirming no suitability for non-electronic soldering applications

Flux Spraying Machine for SMT Printed Circuit Assembly from Japan — Import Duty Rate | HTS 8424.89.10.00