8424.89.10.00/Flux Spraying Machine for SMT Printed Circuit Assembly/Japan

Flux Spraying Machine for SMT Printed Circuit Assembly from Japan

Automated mechanical sprayer that projects selective flux onto PCB pads prior to surface-mount soldering, ensuring reliable joints in high-volume assembly. Optimized for printed circuit assemblies with programmable spray patterns. HTS 8424.89.10.00 classification applies due to exclusive use in PCB soldering processes.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document flux viscosity ranges and nozzle orifice sizes to prove precision for micro-SMT pads

• Require manufacturer's declaration confirming no suitability for non-electronic soldering applications

Flux Spraying Machine for SMT Printed Circuit Assembly from Japan — Import Duty Rate | HTS 8424.89.10.00