Flux Spraying Machine for SMT Printed Circuit Assembly from Japan
Automated mechanical sprayer that projects selective flux onto PCB pads prior to surface-mount soldering, ensuring reliable joints in high-volume assembly. Optimized for printed circuit assemblies with programmable spray patterns. HTS 8424.89.10.00 classification applies due to exclusive use in PCB soldering processes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document flux viscosity ranges and nozzle orifice sizes to prove precision for micro-SMT pads
• Require manufacturer's declaration confirming no suitability for non-electronic soldering applications