Flux Spraying Machine for SMT Printed Circuit Assembly from China
Automated mechanical sprayer that projects selective flux onto PCB pads prior to surface-mount soldering, ensuring reliable joints in high-volume assembly. Optimized for printed circuit assemblies with programmable spray patterns. HTS 8424.89.10.00 classification applies due to exclusive use in PCB soldering processes.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Document flux viscosity ranges and nozzle orifice sizes to prove precision for micro-SMT pads
• Require manufacturer's declaration confirming no suitability for non-electronic soldering applications