Wafer Weight Gauging Platform with Electronic Strain Gauges from China
A specialized platform scale equipped with electronic strain gauges for high-precision weighing of semiconductor wafers post-slicing or lapping, detecting weight variations to gauge material removal uniformity. Classified in HTS 8423.89.1000 for its electronic gauging mechanism in weighing machinery used in wafer preparation. Essential for maintaining flatness tolerances in crystal processing.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Label equipment clearly as 'for semiconductor use' and attach calibration certificates to support classification
• Prepare documentation on resolution (e.g
• 0.1mg) to distinguish from general scales and prevent reclassification