Semiconductor Wafer Edge Grinder Weight Check Scale from Japan
Compact electronic scale integrated post-wafer grinding, using electronic sensors to gauge weight loss for diameter precision in semiconductor wafer preparation. Falls under HTS 8423.89.1000 as other weighing machinery with electronic gauging specific to semiconductor processing. Ensures wafers meet tight tolerances for fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide process flow diagrams showing integration in wafer grinding lines for accurate HTS determination