8423.89.10.00/Semiconductor Wafer Edge Grinder Weight Check Scale/Japan

Semiconductor Wafer Edge Grinder Weight Check Scale from Japan

Compact electronic scale integrated post-wafer grinding, using electronic sensors to gauge weight loss for diameter precision in semiconductor wafer preparation. Falls under HTS 8423.89.1000 as other weighing machinery with electronic gauging specific to semiconductor processing. Ensures wafers meet tight tolerances for fabrication.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide process flow diagrams showing integration in wafer grinding lines for accurate HTS determination