8423.89.10.00/Post-Lapping Wafer Flatness Weighing Gauge/Japan

Post-Lapping Wafer Flatness Weighing Gauge from Japan

Electronic weighing gauge for assessing wafer flatness after lapping/polishing by minute weight mapping across the surface in semiconductor fabrication prep. HTS 8423.89.1000 covers this as weighing machinery using electronic gauging for semiconductor wafers. Ensures surface planarity for device processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document flatness tolerance specs (e.g

• <1um) to support precision weighing claim

• Pair with Chapter 84 statistical note references in entry summaries