Post-Lapping Wafer Flatness Weighing Gauge from Japan
Electronic weighing gauge for assessing wafer flatness after lapping/polishing by minute weight mapping across the surface in semiconductor fabrication prep. HTS 8423.89.1000 covers this as weighing machinery using electronic gauging for semiconductor wafers. Ensures surface planarity for device processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document flatness tolerance specs (e.g
• <1um) to support precision weighing claim
• Pair with Chapter 84 statistical note references in entry summaries