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8423.89.10.00/Post-Lapping Wafer Flatness Weighing Gauge/China

Post-Lapping Wafer Flatness Weighing Gauge from China

Electronic weighing gauge for assessing wafer flatness after lapping/polishing by minute weight mapping across the surface in semiconductor fabrication prep. HTS 8423.89.1000 covers this as weighing machinery using electronic gauging for semiconductor wafers. Ensures surface planarity for device processing.

Duty Rate — China → United States

37.5%

Rate breakdown

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
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Import Tips

• Document flatness tolerance specs (e.g

• <1um) to support precision weighing claim

• Pair with Chapter 84 statistical note references in entry summaries

Post-Lapping Wafer Flatness Weighing Gauge from China — Import Duty Rate | HTS 8423.89.10.00