Post-Lapping Wafer Flatness Weighing Gauge from Canada
Electronic weighing gauge for assessing wafer flatness after lapping/polishing by minute weight mapping across the surface in semiconductor fabrication prep. HTS 8423.89.1000 covers this as weighing machinery using electronic gauging for semiconductor wafers. Ensures surface planarity for device processing.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document flatness tolerance specs (e.g
• <1um) to support precision weighing claim
• Pair with Chapter 84 statistical note references in entry summaries