Semiconductor Wafer Heat-Shrink Wrapping Machine from Japan
This machinery uses heat-shrink film to wrap stacks of semiconductor wafers for protection during transport and storage. It falls under HTS 8422.40.91.81 as other packing or wrapping machinery, specifically heat-shrink wrapping equipment designed for delicate semiconductor materials. The system applies controlled heat to avoid damaging wafer surfaces.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Verify cleanroom compatibility certifications (ISO 14644) to meet semiconductor industry standards; ensure machinery specs confirm no direct wafer contact to avoid Chapter 84 reclassification; provide detailed packing process diagrams in entry documentation